On November 7, ams OSRAM announced a collaboration with Swedish technology company DP Patterning to jointly develop a demonstration sample for automotive lighting.

This demonstration device utilizes a single-layer flexible printed circuit board (FPCB), replacing traditional multi-layer complex designs. According to a Fraunhofer Life Cycle Assessment (LCA) report, CO₂ emissions during the structuring process stage can be reduced by 98% compared to chemical wet etching processes.

This demonstration sample integrates DP Patterning's dry circuit board manufacturing technology with ams OSRAM's AS1163 LED driver. The platform enables independent control of hundreds of light points by connecting LEDs, sensors, and actuators within the vehicle via a single continuous circuit. The AS1163 Smart Autonomous Intelligent Driver (SAID) allows direct integration of low-to-medium power LEDs into OSP networks without requiring additional local microcontrollers.

Unlike traditional electronic circuit technologies using etched grooves and silver paste printing, DP Patterning employs patented Dry Phase Patterning (DPP) technology for high-precision metal film cutting. This process requires no water or chemicals, generating only recyclable dry metal residues while reducing energy consumption and process complexity. A Fraunhofer LCA report indicates DPP technology reduces CO₂ emissions by up to 98% during the structuring process compared to wet etching.

This demonstration unit showcases innovative concepts and potential applications of flexible circuit boards in automotive lighting.

This technology offers greater flexibility for automotive interior ambient lighting and smart surface design. Whether it's a slender light strip along the cabin edge or a large curved light bar, thinner, more easily integrated designs can be achieved. Additionally, this process helps reduce energy requirements, avoids wastewater pollution, and supports local or nearby production, thereby shortening supply chains and improving manufacturing efficiency.

This jointly developed demonstration unit uses a single-layer flexible printed circuit board (FPCB), replacing traditional complex multilayer designs.

DP Patterning will showcase this demonstration sample at booth B2/506 during productronica, held November 18-21, 2025, at the Munich Exhibition Center in Germany. It is important to note that the scope of this LCA study focused solely on the structuring process phase and compared only different process steps, excluding subsequent processes, recycling, infrastructure, and product end-of-life stages. (Source: ams OSRAM)

Publication Dates:

1. PDF (162 pages) - June 30, 2025

2. EXCEL - June 30, 2025; December 31, 2025